产品详情 Details
Ultrasonic bonding
Ultrasonic bonding
产品名称

Ultrasonic bonding

Technical Introduction:

Ultrasonic bonding is suited for bonding two layers with the same material, such as plastic, fiber, silica, etc.

Technical Parameter:
Advantages:

1. It can be used for welding of a variety of composite materials

2. It will not cause high temperature pollution and operation to semiconductor and other materials

3. Easy to weld materials with high thermal conductivity and high electrical conductivity, such as gold, silver, copper, aluminum, etc

4. The cleanliness of the workpiece surface is not high.


Weakness:

The surface of the product is easy to produce scars and cracks

Application:

Chip bonding

Usecase Analysis:

Ultrasonic bonding is suited for bonding two layers with the same material, such as plastic, fiber, silica, etc.


相关产品 Other product
2017 - 08 - 21
CNC machining is an effective way for prototyping at an early stage of the product development.
2017 - 08 - 21
Hochuen medical owns tens of injection molding machines focusing on medical related devices in class 10k clean room for large scale manufacturing.
2017 - 08 - 21
Rotary die cutting is the most effective manufacturing method for low-cost disposable thin-film devices.
2017 - 08 - 22
Hochuen Medical is capable of making fully integrated cartridges for IVD.
X
3

SKYPE 设置

4

阿里旺旺设置

5

电话号码管理

  • 4006-971-972
6

二维码管理

展开