Blog: Bonding and Lamination of Microfluidic Chips

The technology of bonding and lamination of microfluidic chips in Hochuen Medical can allow more than 10 layers to be combined in a highly precise way.

Bonding and lamination Techniques Used For Microfluidic Chips

Looking For the best bonding and lamination for microfluidic chips? Visit Hochuen Medical! You will get the best services and premium quality end product. 

microfluidic chips are durable but very brittle. They need to be stored perfectly so that they do not get damaged or destroyed. If these microfluidic chips get damaged due to the slightest of negligence, the functional efficiency gets reduced by 20 to 30%. So, while manufacturing the microfluidic chips, you need to ensure that the channels that are left open just after the fabrication process must be sealed by bonding and lamination. This will prevent any damage and also does not allow the channels to get clogged. Moreover, it will enhance the functional micro-features of the microfluidic chips. 

In the bonding and lamination of microfluidic chips, generally the physical dimensions, the microfluidic chips' parameters need to be changed. Certain important things have to be involved, such as surface chemistry, bond strength, bond interfaces, material homogeneity, optical properties,  and compatibility of the channel sidewalls, manufacturability to make bonding effective. Only after taking into consideration these aspects will you be able to complete the bonding method appropriately. 

In the process of bonding and lamination of microfluidic chips, the techniques are divided into two different categories - Direct And Indirect.

The Indirect Process Of bonding and lamination of microfluidic chips: 

In this technique, an added material or chemical reagents is used to appropriately perform the bonding and lamination. The materials used here are adhesive tape, epoxy, or chemical reagents. If you are making use of thermoplastic bonding, the intermediate layer will ensure that the bonding is strong and will be able to keep the microfluidic chips intact.

The Direct Process Of Bonding and Lamination of microfluidic chips: 

The techniques that are included in the direct process are as follows - thermal fusion bonding, ultrasonic welding, surface modification, and solvent bonding. With the help of these techniques, you can allow the microfluid substrates' bond to get attached to the interface and enhance efficiency. 

Why is Bonding and Lamination of microfluidic chips useful?

According to the experts, Bonding and lamination of the microfluidic chips are considered one of the most critical aspects of fabricating plastic microfluidic devices. The bonding and lamination of microfluidic chips help seal the micro features. Many industrial units embrace the lamination functionality to achieve the safest and air-bubble-free bond between the micro features and the plastic substrate.  With this lamination procedure, there will be no distortion of micro features, and even the deformation of the microfluidic chips will be extremely minimal.

You would notice many different factors that can potentially destroy the quality of the Bonding and Lamination of microfluidic chips. These factors include excessive heat, the air pressure inside the chip assembly, and external pressure. But you won’t find any such issues when you are getting the microfluidic chips laminated at Hochuen Medical. The services provided at  Hochuen Medical are highly reliable, and you can ensure that the final product you receive would be of the best quality. The plastic substrate used for the lamination and bonding process is of premium quality and made from cyclic olefin copolymer (COC) resins. Generally, in the bonding and lamination of microfluidic chips, the main problem arises when the required materials are not available. But Hochuen Medical has a good stock of the required material and ensures that the bonding and lamination of microfluidic chips are achieved without any difficulty.